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Lukas Schmidt Lukas Schmidt

Lukas Schmidt Semiconductor Lithography & Advanced Packaging Fellow

Lukas Schmidt is the Semiconductor Lithography & Advanced Packaging Fellow at Eyestech. Dresden-based microelectronics engineer (Silicon Saxony) specializing in High-NA EUV lithography, CoWoS/chiplet packaging, and global foundry tooling.

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The $30,000 Wafer Crisis: Why Apple’s A20 Pro 2nm Leap Left the Base iPhone 18 in Silicon Limbo
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The $30,000 Wafer Crisis: Why Apple’s A20 Pro 2nm Leap Left the Base iPhone 18 in Silicon Limbo

Lukas Schmidt By Lukas Schmidt

A semiconductor engineering investigation by Lukas Schmidt: inside TSMC’s $30,000 N2 wafer costs, A20 Pro GAAFET nanosheet physics, the WMCM packaging revolution, and why the base iPhone 18 is trapped on 8GB RAM without on-device Apple Intelligence.

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