OpenAI’s 10 GW ASIC Alliance: Escaping Nvidia’s 75% Margin
OpenAI and Broadcom booked TSMC 3nm/2nm capacity for a 10 GW inference ASIC deployment by 2029. Here is the CoWoS math, Ethernet fabric, and 60% TCO savings.
Lukas Schmidt Editorial profile
EyesTech Manufacturing & Packaging Desk, covering 2.5D/3D silicon interposers, TSMC CoWoS allocation, and advanced foundry yields. Editorial Standards: https://eyestech.in/editorial-policy/
Europe’s €3 Billion Sovereign Counter-Offensive: Inside Mistral’s War Chest to Challenge OpenAI Astra and Meta’s Megawatt Moats
Inside Mistral AI’s historic €3 Billion Series D funding round at a €21B+ valuation led by Samsung and ASML. A forensic systems investigation into European sovereign AI, French nuclear baseload arbitrage, sparse MoE token economics, and enterprise air-gap architectures vs closed US frontier APIs.
The $30,000 Wafer Crisis: Why Apple’s A20 Pro 2nm Leap Left the Base iPhone 18 in Silicon Limbo
A semiconductor engineering investigation by Lukas Schmidt: inside TSMC’s $30,000 N2 wafer costs, A20 Pro GAAFET nanosheet physics, the WMCM packaging revolution, and why the base iPhone 18 is trapped on 8GB RAM without on-device Apple Intelligence.