The $200B Semiconductor Pivot: EY-IESA Report Breakdown
India’s chip demand hits $200B by 2035 as imports surge to $30.3B. Forensic breakdown of what domestic fabs and OSAT packaging lines must absorb to survive.
Dr. Marcus Vance
Principal Hardware & Silicon Analyst at Eyestech. Former ASIC verification and physical design engineer specializing in HBM memory architectures, tensor cores, and datacenter accelerator clusters.
Google Project Suncatcher: Can TPUs Scale in Orbit?
Google’s Project Suncatcher evaluates deploying Trillium TPUs to orbit. We analyze vacuum heat rejection, proton radiation, and 10 Tbps free-space optical DWDM.
Meta Outage Autopsy: Why Facebook Can’t Keep You Logged In
From the 2021 BGP route collapse to the June 2026 auth lockout: why Meta’s fail-open guardrails and coupled identity plane keep breaking global reach.
Tata Dholera Fab & Applied $5B: 28nm Cleanroom Breakthrough
Applied Materials commits $5B as the Tata Dholera Fab enters cleanroom fit-out for Dec 2026 trial runs. We audit India’s 28nm equipment and supply chain.
Beyond CoWoS: Why Nvidia Killed the 4-Die Rubin Ultra and Scrambled a 17% Fan-Tax Air Rack
An investigative semiconductor teardown by Dr. Marcus Vance: why package warpage forced Nvidia to cancel the 4-die Rubin Ultra, how screaming chassis fans burn 17% of total rack power in the MGX GB200A air compromise, and the race toward glass core substrates.
Pixel 11 and Tensor G6: Is Google Finally Making On-Device AI Useful?
The short answer This Pixel 11 Tensor G6 on-device AI review asks a simple question: is Google finally making on-device…